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Microelectronics Materials and Devices
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Introduction3 Topics
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Crystal Structure17 Topics
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Semiconductor Devices in Microelectronics
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Atom Arrangement (Carbon) vs Material Property
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Crystal Structure and Ordering
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Crystal Structure
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Cubic Lattices
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Derivatives of FCC Lattices
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Hexagonal Lattices
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Cubic Close Packing
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Hexagonal Close Packing
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Atomic Packing Factor
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Planes and Directions
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Directions in Crystal
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Applications of Miller Indices: Si Wafers
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Crystallographic Orientation
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Crystal Plane and Crystal Direction
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Experimental Determination of Crystal Structure & Properties
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Summary and Learning Outcomes
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Semiconductor Devices in Microelectronics
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Energy Bands
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Dielectrics and Other Non-semiconductor Materials
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Semiconductors
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P-N Junctions
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MOS Capacitors
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Metal Semiconductor Contacts
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Closed Packed Structure
In 2D, close packed layers is the most efficient way of packing equal sized spheres.

i.e. the maximum possible packing for 2D.
Can stack close packed (c.p.) to give 3D structures.
3D Closed Packed Structure

First layer is A (blue) and second layer is B (red).
Third layer, there are two possibilities:
- Can have A position again (blue). This leads to the regular sequence
…ABABABA…..Hexagonal close packing (hcp) - Can have layer in C position (green), followed by the same repeat,
to give …ABCABCABC… Cubic close packing (ccp)
Difference between hexagonal closed packed (hcp) and cubic closed packed (ccp) structures

